Skip to product information
1 of 12

Unbranded

Vintage 1970s Aerospace Military Medical Hybrid Microcircuit Display Lot L1011

Vintage 1970s Aerospace Military Medical Hybrid Microcircuit Display Lot L1011

Regular price $850.00 USD
Regular price $0.00 USD Sale price $850.00 USD
Sale Sold out
Shipping calculated at checkout.
Quantity
Purchased from an estate sale of an engineer & collector

Vintage 1970s Aerospace, Military & Medical Hybrid Microcircuit Curated Display LotOverviewUp for auction is a truly unique, museum-grade historical archive of late-1970s cutting-edge microelectronics engineering. This curated presentation box contains 14 distinct vintage components, including open-face hybrid microcircuits, military-grade flat-packs, and mechanical telecommunications hardware.What makes this lot exceptionally rare is that it was compiled and meticulously preserved by an industry engineer. Each section features handwritten documentation identifying the specific, legendary platforms these modules were designed for.Historical Provenance & Components Included:1978 Cold War Harpoon Missile Guidance Module: A pristine, hermetically sealed CTS Corporation TO-8 metal can component. Features clear military stamping: CTS 571790 / Date Code 7819 (manufactured May 1978 for early production Block 1A missile systems).Lockheed L-1011 TriStar Aircraft Avionics Flat-Pack: An unlidded 10-lead aerospace flat-pack header with flat ribbon leads and exposed internal gold traces. Tied directly to the pioneering automated flight systems of the iconic 1970s widebody jet.Early Implantable Biomedical Hardware (Open-Face "Naked Tech"):Heart Pacer / Pacemaker Modules: Three distinct architectural variations showing the evolution of life-saving tech. Includes highly dense gold-etched layouts, silver-platinum alloy trace versions, and high-capacity capacitor energy-storage blocks.Bone Growth Stimulator Circuit: A beautiful, highly symmetrical dual-channel thick-film ceramic hybrid circuit featuring laser-trimmed ruthenium oxide resistors."Various Chip & Wire Hybrids" Set: A grouping of 5 unique ceramic modules illustrating historical variations in manual ultrasonic bonding, silicon integrated circuit (IC) die placement, and high-density micro-packaging.1979 Telecom Communications Module: A distinct Binary Coded Decimal (BCD) 8-pin right-angle DIP rocker switch bank. Features a 7915 date stamp (April 1979) from the era of early digital network routing.High-Density DIP Microcircuit: An unlabelled center-piece module bridging the gap between traditional integrated computer chips and hybrid packages.Visual Aesthetic & ConditionCondition: Excellent vintage cosmetic condition.Engineering Display: The medical and aerospace modules are unlidded/decapped, revealing the stunning internal architecture. Under standard lighting or a magnifier, the pure 24k gold wire bonds, microscopic silicon logic dies, and laser-etched circuits are completely visible.Turnkey Presentation: The collection is cleanly organized on a protective, anti-static black foam backing inside a clear-lidded storage case with original handwriting intact. It is ready for desk display, framing, or integration into a tech history showcase.
View full details